Our offer
An industrial site, decades of expertise at the service of our customers
Our industrial site
EYCO is a key player in the European microelectronics industry, recognized for its expertise, innovation and ability to produce in very high volumes. Located in Trets (13), in the heart of the French Silicon Valley, our 3,700 m² site is equipped with the most advanced technologies to offer packaging solutions adapted to current and future needs.
With a production capacity of several hundred million units a year, extensions are planned to exceed one billion units.
The site is ISO9001 certified.
Our technological expertise
With 130 years of cumulative experience in microelectronics, we have developed technological expertise, enriched by the talents of our teams.
EYCO excels particularly in materials processing and multi-layer solutions.
Innovation is at the heart of our processes and technologies, enabling us to achieve levels of quality and performance that meet or exceed our customers’ expectations.
Co-development
We support each of our customers in creating their own value, using processes and machines designed exclusively by EYCO and to which we give free access.
Every final product is the result of this co-development process.
Confidential, secure and virtuous, we call this approach To “live by an industrial gesture”.
Ultra-thin chip carriers in R2R format
- Double-sided with or without adhesive
- Contact: Nickel, Nickel Phosphorus, Palladium, Scratch-resistant gold alloy
- Bonding: Nickel, pure gold
Solutions for heterogeneous integration
Heterogeneous integration is a key element of innovation in microelectronics.
Today, our mastered technological building blocks enable us to develop heterogeneous integration solutions on flexible substrates, in R2R or wafer format.
- Embedded die
- Chip interconnection with copper
INTEGRATION
RELIABILITY
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About EYCO